Elpida Memory's 512 Megabit Mobile RAM(TM) Device Fits in Smaller Package for 3G Phones; 90 nm Process Technology Enables Smaller Die Size, Easier Implementation in Multi-Chip-Package and System-in-Package Designs
TOKYO—(BUSINESS WIRE)—July 13, 2005—
Elpida Memory, Inc. (Elpida), Japan's leading global
supplier of Dynamic Random Access Memory (DRAM), today announced that
it has started shipping samples of small form-factor, 512 Megabit
Mobile RAM devices for high-performance, 3G cellular applications. By
utilizing 90 nm process technology, Elpida can now offer customers 512
Megabit Mobile RAM devices with a smaller and square die for easier
implementation into Multi-Chip Package (MCP) and System-in-Package
(SiP) designs which require 11 x 11 mm packages or smaller to save
valuable board space.
"As feature-rich cellular phones become more mainstream, the
demand for high-density Mobile RAM is steadily increasing," said Akira
Yabu, manager of Technical Marketing at Elpida Memory (USA). "Elpida's
512 Megabit devices with 90 nm design geometry are ideal for
supporting handset systems with real-time operating systems such as
Linux, Symbian or Windows CE that require high-density memory, but
have limited space."
Elpida's 512 Megabit Mobile RAM -- Technical Details
Elpida's 512 Megabit Mobile RAM devices (Part numbers:
ECK5416CBC1, ECK5132CBCN, ECK5432CBC1, ECL5416CBC1, ECL5432CBC1) are
organized as 16M words x 32-bits or 32M words x 16-bits, respectively,
and they are available in either SDR or DDR architectures depending on
application performance requirements.
Elpida plans to expand its 90 nm line up by adding 128 Megabit and
256 Megabit Mobile RAM products later this year. Elpida also offers
volume production on a variety of 90 nm DDR2 SDRAM products for the
server market.
Availability
Elpida's 512 Megabit Mobile RAM devices are currently sampling to
customers. Volume production is planned for the 3rd quarter of 2005.
About Elpida Memory, Inc.
Elpida Memory, Inc. is a manufacturer of Dynamic Random Access
Memory (DRAM) silicon chips with headquarters based in Tokyo, Japan,
and sales and marketing operations located in Japan, North America,
Europe and Asia. Elpida's state-of-the-art semiconductor wafer
manufacturing facilities are located in Hiroshima, Japan. Elpida
offers a broad range of leading-edge DRAM products for high-end
servers, mobile phones, digital television sets and digital cameras as
well as personal computers. Elpida had sales of 207.0 billion yen
during the fiscal year ending March 31, 2005. For more information,
visit www.elpida.com.
Mobile RAM is a trademark of Elpida Memory, Inc.
All other trademarks are the property of their respective owners.
The information contained within this news release, is current as
of the date of release. Please note that the information herein may be
revised later without prior notice.
Contact:
Elpida Memory, Inc. (Japan)
Yuko Takahashi, +81-3-3281-1648 (Asia/Japan)
Email Contact
or
Elpida Memory (Europe) GmbH. (Germany)
Peter Westerdorf, 0049 (0)211 23945120 (Europe)
Email Contact
or
Lee Communications - PR for Elpida Memory (USA) Inc.
Heather Roberts, 408-288-8681 (North America)
Email Contact
